CNC Machining of Semiconductor Wafer Rings in Virgin PEEK
Operating in an oil-free clean environment, we machine 300mm wafer handling end-effectors with micro-milled suction channels holding flatness within 0.015mm.
- Machined with calibrated multi-axis kinematics minimizing tool deflection
- GD&T true position inspected within ±0.005mm using automated CMM
- Full material mill certs, heat treat data, and FAI documentation provided
